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Solutions Overview
MYLAR SHEET REMOVERS
IC-SUBSTRATE &
PANEL-LEVEL PACKAGING
SOLUTIONS
01 / MYLAR SHEET REMOVERS
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Third iteration of the world's most successful automated mylar peeler
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Specifically developed for IC-substrates (ABF, DFR, SR etc.)
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Updated version of the world's most successful automated mylar peeler
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For ABF and glass substrates
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Additional knurling device for process stability
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Designed for IC-substrates (ABF, DFR, SR etc.)
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Specifically developed for removing dry-film protective films
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Glas core compatible
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Equipped with an in-house developed EFEM
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